page 1 1 2 2 2 2 3 4 4 4 5 6 6 7 list list................................................................................................. package outline............................................................................... features.......................................................................................... maximum ratings ............................................................................. rating and characteristic curves........................................................ pinning information........................................................................... marking........................................................................................... suggested solder pad layout............................................................. packing information.......................................................................... reel packing.................................................................................... suggested thermal profiles for soldering processes............................. high reliability test capabilities........................................................... mechanical data............................................................................... formosa ms HFM101-MH1 thru hfm107-mh1 http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. ds-121319 2014/01/20 - a 7 chip high effciency rectifiers
page 2 formosa ms 1.0a surface mount high effciency rectifiers-50-1000v http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. low profile surface mounted application in order to optimize board space. t high current capability. high surge current capability. glass passivated chip junction. features ? ? iny plastic smd package. ultrafast recovery time for high efficiency. lead-free parts meet rohs requirments. ? suffix "-h" indicates halogen free parts, ex. HFM101-MH1-h. ? ? ? ? ? ? document id issued date revised date revision page. maximum ratings and electrical characteristics (at t =25 a o c unless otherwise noted) chip high effciency rectifiers ds-121319 2014/01/20 - a 7 note 1. reverse recovery time test condition, i =0.5a, i =1.0a, i =0.25a 2. frrr measured at 1 mhz and applied reverse voltage of 4.0 vdc symbols parameter HFM101-MH1 hfm102-mh1 hfm103-mh1 unit hfm104-mh1 hfm105-mh1 hfm106-mh1 hfm107-mh1 maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v v maximum rms voltage v rms 35 70 140 280 420 560 700 maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward rectified current i o 1.0 a peak forward surge current 8.3ms single half sine-wave(jedec method) i fsm 25 a maximum forward voltage at i =1.0a f v f 1.00 v i r maximum dc reverse current t =25 c at rated dc blocking voltage t =125 c j j 5.0 150 ua ua c j typical junction capacitance (note 2) 20 pf maximum reverse recovery time (note 1) t rr 50 ns 75 t j operating junction temperature range -55 to +150 c t stg storage temperature range -55 to +150 c 1.30 1.70 HFM101-MH1 thru hfm107-mh1 mechanical data epoxy : ul94-v0 rated flame retardant case : molded plastic, terminals :plated terminals, solderable per mil-std-750, method 2026 polarity : indicated by cathode band mounting position : any ? ? ? ? ? ? sod-123h1 weight : approximated 0.0103 gram package outline dimensions in inches and (millimeters) sod-123h1 0.031(0.8) typ. 0.146(3.7) 0.130(3.3) 0.004(0.1) typ. 0.031(0.8) typ. 0.012(0.3) typ. 0.071(1.8) 0.056(1.4) 0.040(1.0) 0.024(0.6)
page 3 .4 .6 .8 1.0 1.2 1.4 .001 .01 .1 1.0 10 rating and characteristic curves (HFM101-MH1 thru hfm107-mh1) fig.1-typical forward characteristics instantaneous for ward current ,(a) forward voltage,(v) pulse width 300us 1% duty cycle (+) (+) 25vdc (approx.) ( ) ( ) pulse generator (note 2) oscilliscope (note 1) 1 non- inductive notes: 1. rise time= 7ns max., input impedance= 1 megohm.22pf. 2. rise time= 10ns max., source impedance= 50 ohms. +0.5a 0 -0.25a -1.0a | | | | | | | | 1cm set time base for 50 / 10ns / cm trr d.u.t. fig.3- test circuit diagram and reverse recovery time characteristics 10 noninductive 50 noninductive t =25 c j fig.2-typical forward current average for ward current ,(a) 0.2 0.4 0.6 0.8 1.0 1.2 derating curve lead temperature ( c) 1.6 1.8 hfm105-mh1~hfm107-mh1 hfm104-mh1 HFM101-MH1~hfm103-mh1 0 25 50 75 100 125 150 175 0 fig.4-maximum non-repetitive forward surge current http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. peak for waard surge current ,(a) number of cycles at 60hz 10 0 20 30 40 50 110 5 50 100 t =25 c j 8.3ms single half sine wave jedec method p.c.b. mounted on 0.2 x 0.2 (5 mm x 5 mm) copper pad areas "" fig.5-typical junction capacitance reverse voltage,(v) junction cap acitance,(pf) 140 120 100 80 60 40 20 0 .01 .05 .1 .5 1 5 10 50 100 ds-121319 2014/01/20 - a 7
pinning information 1 2 pin1 cathode pin2 anode pin simplified outline symbol marking type number marking code suggested solder pad layout dimensions in inches and (millimeters) a c b page 4 formosa ms HFM101-MH1 h1 hfm102-mh1 h2 hfm103-mh1 h3 hfm104-mh1 h4 hfm105-mh1 h5 hfm106-mh1 h6 hfm107-mh1 h7 http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. chip high effciency rectifiers ds-121319 2014/01/20 - a 7 b 0.051 (1.30) a 0.071 (1.80) c 0.067 (1.70) package sod-123h1 2 1 HFM101-MH1 thru hfm107-mh1
packing information item tolerance sod-123h1 carrier width carrier length carrier depth sprocket hole 13" reel outside diameter 7" reel outside diameter 13" reel inner diameter 7" reel inner diameter feed hole diameter sprocket hole position punch hole position punch hole pitch sprocket hole pitch embossment center reel width overall tape thickness tape width p 0 p 1 e b c d f t w p a d d d 1 d 1 d 2 w 1 symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 - 178.00 - 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 p 0 p 1 e b d f w p a d d 1 d 2 w 1 c t page 5 note:devices are packed in accor dance with eia standar rs-481-a and specifications listed above. 2.00 3.85 1.10 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. chip high effciency rectifiers ds-121319 2014/01/20 - a 7 HFM101-MH1 thru hfm107-mh1
page 6 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. sod-123h1 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.5 package reel size reel component spacing box inner box reel dia, carton size carton approx. gross weight (kg) (pcs) (m/m) (m/m) (m/m) (pcs) (m/m) (pcs) reel packing profile feature soldering condition average ramp-up rate(t to t ) <3 /sec preheat -temperature min(tsmin) 150 -temperature max(tsmax) 200 -time(min to max)(t ) 60~120sec tsmax to t -ramp-uprate <3 /sec time maintained above: -temperature(t ) 217 -time(t ) 60~260sec peak temperature(t ) 255 0/ 5 time within 5 of actual peak temperature(t ) ramp-down rate <6 /sec time 25 to peak temperature <6minutes lp s l l l p p o o o o o oo o o o c c c c c c- + c c c c 3.reflow soldering 10~30sec 1.storage environment: temperature=5 ~40 humidity=55%25% 2.reflow soldering of surface-mount devices oo cc suggested thermal profiles for soldering processes critical zone tl to tp critical zone tl to tp tl tsmax tsmin ramp-up tp ts preheat t25 c to peak o time 25 tl tp ramp-down temperature chip high effciency rectifiers ds-121319 2014/01/20 - a 7 HFM101-MH1 thru hfm107-mh1
page 7 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. chip high effciency rectifiers ds-121319 2014/01/20 - a 7 HFM101-MH1 thru hfm107-mh1 1. solder resistance 2. solderability 3. high temperature reverse bias 4. forward operation life 5. intermittent operation life 6. pressure cooker 7. temperature cycling 8. forward surge 9. humidity 10. high temperature storage life at 260 5 for 10 2sec. immerse body into solder 1/16" 1/32" at 245 5 for 5 sec. v =80% rate at t =150 for 168 hrs. rated average rectifier current at t =25 for 500hrs. t = 25 c, i = i on state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. 15p at t =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. 8.3ms single half sine-wave , one surge. at t =85 , rh=85% for 1000hrs. at 175 for 1000 hrs. c c c c c cc c c o o o o o oo o o rj a afo sig a a o mil-std-750d method-2031 mil-std-202f method-208 mil-std-750d method-1038 mil-std-750d method-1027 mil-std-750d method-1036 mil-std-750d method-1051 mil-std-750d method-4066-2 mil-std-750d method-1021 mil-std-750d method-1031 jesd22-a102 item test conditions reference high reliability test capabilities
|
